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Services > Printed Circuit Boards > PCB Assembly > Assembly Capabilities
 

Assembly Capabilities

Standard Assembly Capabilities include:

  • SMT & Through-hole
  • High Speed Placement
  • BGA and Micro-BGA Capabilities
    • CSP (Chip Scale Packaging)
    • Flip Chip
    • X-Ray Verification (if required)
    • Reballing
    • Rework (De-population and Re-population)
    • Same Day and Next Day Service
  • Fine Pitch
  • 0201 Placement
  • Optimized Reflow Profiling
  • Turnkey or Consigned Kits
  • Press Fit Connectors
  • Quick-Turn Assemblies (Same Day & Next Day)
  • Prototype Quantities
  • Production Quantities w/Scheduled Deliveries
  • High Volume Production
  • Double-Sided SMT
  • De-ionized Wash
  • Rework Capabilities
    • De-population and Re-population
    • Fine Pitch
    • Cuts & Jumps
    • Piggybacks & Teepees
    • Minor PCB Repair
    • Same Day & Next Day Service
  • IPC-A-610 Class III Capable
  • Strict ESD Control
  • Mechanical Assembly and Box Builds
  • Work Closely w/In-House Design Team on DFM and DFT Issues
  • Cable & Harness Assembly
  • Functional Testing

Mixed Assembly
We provide mixed assembly placement, which can often require three operations. These are surface mount (SM), plated through hole (PTH) and for most projects, the implementation of heat sinks, cables or press fit connectors tenable PTH I/communications. The advent of high speed designs however, has converted some of these connectors from PTH tSM because of SM’s tighter tolerances.

That’s why Design for Manufacture (DfM) has gained increasing prominence as a critical part of mixed assembly placement for engineers working at the design layout stage. Mixed assembly placement needs tbe done correctly and that requires consideration of all factors during DfM in order tavoid potentially costly mistakes. A rigorous analysis and study of SM and PTH placement can prevent problems:

  • Be sure SM components are placed first, since the smaller percentage of PTH (10-15%) can be hand-placed later in the assembly process
  • Prevent the interference with nearby cables or wires, place your connectors close tthe PCB edge
  • Insure that tolerances are tight and secure on solder, AOI, pick and place and all assembly equipment
  • Be aware of any components that have heat sensitivity and make sure they are protected with the right wave solder equipment
  • Be proactive in mitigating possible SM and PTH problems by thorough planning at the CAM stage
  • Pay close attention to mixed placement assembly issues associated with lead-free components as these require special handling to avoid any thermal problems

An effective DfM plan includes these important factors and many others that need tbe put intpractice and maintained. Rigorous planning at the DfM stage insures that elements such as bifurcation are done accurately even in an environment of numerous restrictions. These restrictions can pertain ta variety of issues including mechanical, height, or those associated with wires, chassis or cables.

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