FDA

IPC-600F Guideline *

Board edges

• Haloing and nicks maximum .100" or 50% of distance to nearest conductor, whichever is less.

Bow and twist

• General 1.5% max.
• SMT boards 0.75%. max.

Conductor thickness

• Table 3-9 (external)
• Table 3-8 (internal)

Copper plating thickness, minimum in holes

• Class 2, avg. .0008" , thin spots .0007"
• Class 3, avg. .001", thin spots .0008" (Table 3-2)

Copper plating voids

• Class 2 - One Cu void allowed per hole in not more than 5% of the holes.
• Class 3 - No Cu voids allowed.
• Shall not exceed 5% of hole length or 90° of circumference (Table 3-3)

Delamination/blisters

• Evaluated in accordance with IPC-A-600
• Class 1 now same as Class 2, 3 (2.3.3)
• Evidence of delamination in micro section now refers to 2.3.3 instead of being automatically nonconforming (3.1.4)

Solder Dewetting

• Ground planes and traces: allowed
• Solder connection areas: max. 5% (Class 2, 3)

Finish plating voids

• Class 2 - Three solder voids allowed per hole in not more than 5% of the holes.
• Class 3 - One solder void per hole in not more than 5% of the holes.
• Shall not exceed 5% of hole length or 90° of circumference (Table 3-3)

Foreign inclusions

• Evaluated in accordance with IPC-A-600, except no maximum dimension specified (3.3.2.1)

Gold thickness

• Class 2 - min. 30µ"· Class 3 - min. 50µ"· Solderable gold - 30µ" maximum.

Hole location

• As specified on procurement document.

Hole sizes

• ±.004" for plated through holes, ±.003 for non-plated through holes, +.003 / - hole size for vias, unless otherwise specified by customer

Solder Mask coverage

• See 3.8.1

Solder Mask cure & adhesion

• No tackiness
• Blisters/delamination: 2 per side, max. .010 in, does not reduce spacing by more than 25%
• Soda-strawing is now defined as applying to DFSM only (2.9.9)

Solder Mask in holes

• Allowed only in holes in which are not to be soldered.

Solder Mask registration

Solder Mask thickness

• Visual coverage; no thickness requirement

Solder Mask touch-up

• Touch-up material specified (IPC-A-600F 2.9.1)

Measles/crazing

• Evaluated in accordance with IPC-A-600
• Measles acceptable for all except high voltage applications [not defined] (2.3.1)
• Crazing spec. now same as delamination except 50% of distance between conductors may be spanned; also now shows pictures of crazing (2.3.2)

Min. ann. ring NPTH

• Class 2: No breakout allowed.

Min. ann. ring-internal

• Class 2: 90° breakout allowed

Min. external ann. ring - PTH

• Class 2: 90° breakout allowed except at junction of pad and trace, where .002" minimum is allowed.

Nomenclature (silkscreen)

• Refers to IPC-A-600 for legibility requirements Marking ink on surface mount lands no longer nonconforming (IPC-A-600F 2.8.3)

Nonwetting

• None allowed

Pink ring

• Acceptable (3.3.2.6)

Pits and voids in base material

• Acceptable if no larger than 0.8 mm [.03 in] and no more than 5% of board area

Plating adhesion

• Tape test required (slivers coming off with tape is not cause for rejection)

Plating cracks

• See Table 3-7 (basically none allowed)

Resin fill of blind/buried vias

• Buried vias shall be at least 60% filled with resin (3.3.14)

Routing tolerances

• As specified on procurement document.

Spacing reduction

• When not specified on the customer's documentation, 30% allowed for class 2; 20% allowed for class 3.

Tenting (via holes)

Tin/lead, solder coat

• Unfused tin-lead: min. thickness .0003"
• Fused or HAL: coverage and solderable.
• Sidewalls do not have to be covered.

Trace width

• Class 2, 3: When not specified on the customer's documentation, 20% max. line loss, additional 20% for isolated defects

Weave exposure and exposed/disrupted fibers

• Acceptable for Class 1, 2, 3 as long as minimum conductor spacing is met.

Weave texture

• Not addressed